2016-Sustainable Industrial Processing Summit
SIPS 2016 Volume 7: Yang Intl. Symp. / Multiscale Material Mechanics
| Editors: | Kongoli F, Aifantis E, Wang H, Zhu T |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2016 |
| Pages: | 190 pages |
| ISBN: | 978-1-987820-48-5 |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
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Analysis of stress singularities in thin-films bonded to a graded substrate
Peijian Chen1; Juan Peng2;1, Xuzhou, China; 2CUMT, Xuzhou, China;
Type of Paper: Regular
Id Paper: 310
Topic: 1
Abstract:
The mechanical behavior of film/substrate systems is continuously concerned due to the important application in a large number of fields in recent decades. In the present paper, the interface behavior of a thin-film adhering to a graded substrate is analyzed by a new model when the interface between the thin-film and the graded layer is subjected to a mismatched strain. The fundamental solution of a graded substrate under a pair of normal and tangential concentrated forces is obtained first, and then the mismatch problem of a thin-film bonded to the substrate is further investigated. Solving the obtained integral governing equation of Cauchy singularity leads to the interfacial shear stress, the normal stress in the film, as well as the stress intensity factor near the bonded edge. It is found that the interfacial mechanics of a thin-film bonded to a graded layer is significantly affected by varying gradient law, stiffness of the film, ratio of shear modulus and length scale of the graded transition layer. The results should be helpful for the design of systems with thin-films and functionally graded materials and could guide engineers to choose properly graded materials for particular applications.