2018-Sustainable Industrial Processing Summit
SIPS2018 Volume 5. Zehetbauer Intl. Symp. / SISAM
| Editors: | F. Kongoli, S. Kobe, M. Calin, J.-M. Dubois, T. Turna |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2018 |
| Pages: | 154 pages |
| ISBN: | 978-1-987820-90-4 |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
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Heterostructured Materials: A New Paradigm for Designing Metals for Superior Mechanical Properties
Yuntian Zhu1;1NORTH CAROLINA STATE UNIVERSITY, Raleigh, United States;
Type of Paper: Keynote
Id Paper: 291
Topic: 42
Abstract:
Strong and tough materials are desired for structural applications such as transportation vehicles for high energy efficiency and good performance. After over a century's research, we have almost reached the limit on how much further we can improve the mechanical properties of metals and alloys. This raises the question if there exists yet-to-be-explored new strategies to make the next generation of strong and tough materials. Recently, heterostructure is found to produce unprecedented strength and ductility that are considered impossible from our textbook knowledge and materials history. Heterostructured (HS) materials consist of domains with dramatic strength differences. A previously not-well-known mechanism, back-stress strengthening and back-stress work hardening, is found responsible for such a dramatic improvement of mechanical properties. This represents a new paradigm for designing strong and tough structural materials. HS materials have recently attracted extensive attention in the academic community as an emerging research field. Moreover, HS materials can be produced by current industrial facilities at large scale and low cost, and has the potential to revolutionize the manufacturing industry. There are many scientific issues with such materials that challenge the communities of experimental materials science and computational material mechanics. In this talk, the authors will present the current advances as well as future challenges and issues in this emerging field.