2018-Sustainable Industrial Processing Summit
SIPS2018 Volume 5. Zehetbauer Intl. Symp. / SISAM

Editors:F. Kongoli, S. Kobe, M. Calin, J.-M. Dubois, T. Turna
Publisher:Flogen Star OUTREACH
Publication Year:2018
Pages:154 pages
ISBN:978-1-987820-90-4
ISSN:2291-1227 (Metals and Materials Processing in a Clean Environment Series)
CD-SIPS2018_Volume1
CD shopping page

    Plasticity Induced Grain Boundary Migration

    Reinhard Pippan1; Oliver Renk1; Marlene Kapp1; Karoline Komout1; Pradpita Ghosh1; Anton Hohenwarter2;
    1ERICH SCHMID INSTITUT OF MATERIALS SCIENCE, AUSTRIAN ACADEMY OF SCIENCES, Leoben, Austria; 2MONTANUNIVERSITAET LEOBEN, Leoben, Austria;
    Type of Paper: Keynote
    Id Paper: 311
    Topic: 42

    Abstract:

    Grain boundary migration is an important phenomenon during hot working of materials. It is key to understanding the microstructural evolution during the deformation process, and is an essential mechanism for microstructural design of materials. This phenomenon of grain boundary migration during hot forming has been a central research area in material science in the last century. It was long assumed that grain boundary migration during cold deformation does not occur. The generation of ultrafine grained and nanocrystalline material by low temperature heavy plastic deformation has been introduced during the last two decades. In order to understand the minimum grain size, which can be achieved by these processes, it becomes quite evident that grain boundary migration plays a key role. A central question of this grain boundary movement is: "What are the driving forces and what controls the resistance against the movement of the grain boundaries at these low temperatures?" Further important points resulting from this question are: "What is the role of thermally activated processes and what is the contribution of stress and strain induced transfer of atoms from one grain to the other?" This presentation will focus on these central questions by analyzing grain boundary movement as a function of deformation temperature, strain rates, strain paths, impurities, and alloying elements. It will be shown that grain boundary movement during heavy plastic deformation at low temperature has a similar importance as in the case of dynamic recrystallization during hot working, only the driving forces are different. Finally, it will be shown that these phenomena of deformation induced grain boundary migration at low temperatures are important in order to understand the strength of ultrafine grained and nanocrystalline materials.

    Keywords:

    Grain boundary migration; Severe plastic deformation (SPD); Nanocrystalline materials; Ultrafine grained materials; Deformation; Triple junctions;

    References:

    [1] Recrystallization and related annealing phenomena, F.J. Humphreys and M. Hatherly, Elsevier 2004
    [2] O. Renk, A. Hohenwarter, S. Wurster, R. Pippan Acta Mater. 2014;77:401-410
    [3] O. Renk, P. Ghosh, R. Pippan Scripta Mater. 2017;137:60-63
    [4] D.S. Gianola, S. Van Petegem, M. Legros, S. Brandstetter, H. Van Swygenhoven, K.J. Hemker Acta Mater. 2006;54:2253-2263
    [5] M.W. Kapp, O. Renk, P. Ghosh, T. Leitner, B. Yang, R. Pippan J Mater. Res. 2017;32:4317-4326

    Cite this article as:

    Pippan R, Renk O, Kapp M, Komout K, Ghosh P, Hohenwarter A. (2018). Plasticity Induced Grain Boundary Migration. In F. Kongoli, S. Kobe, M. Calin, J.-M. Dubois, T. Turna (Eds.), Sustainable Industrial Processing Summit SIPS2018 Volume 5. Zehetbauer Intl. Symp. / SISAM (pp. 75-76). Montreal, Canada: FLOGEN Star Outreach