2025 - Sustainable Industrial Processing Summit
SIPS2025 Volume 5. Meyers Intl. Symp. / Composite
| Editors: | F. Kongoli, P. Assis, H.A.C. Lopera, S. Diaz, S.N. Monteiro, V.S. Candido |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2025 |
| Pages: | 316 pages |
| ISBN: | 978-1-998384-46-4 (CD) |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
CD shopping page
FABRICATION OF PARTICLE-FREE SILVER INK AND ITS APPLICATION TO LOW-TEMPERATURE SINTERABLE HIGH-CONDUCTIVITY PASTE
Jong-Hyun Lee1;1SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY, Seoul, South Korea;
Type of Paper: Regular
Id Paper: 214
Topic: 18
Abstract:
In addition to conventional applications in the printing of electrodes or antenna patterns on low-cost polymer substrates, the application of low-temperature sinterable Ag pastes is now also being explored for electrode fabrication in perovskite solar cells. In this study, a particle-free Ag ink was synthesized based on an Ag-organic complex, and a printable paste capable of sintering at 120 °C was formulated by adding Ag flakes. The corresponding properties were systematically evaluated. For the optimization of ink formulation, the optimal combination of Ag salt and amine-based complexing agents was determined, and a solvent exhibiting both rapid evaporation at low temperatures and synergistic compatibility with the complex system was selected, enabling film formation at 120 °C. Subsequently, after the optimal amount of Ag flakes was incorporated, the resistivity of the film decreased with increasing annealing time at 120 °C, ultimately achieving an excellent electrical resistivity of 1.13 × 10⁻⁵ Ω·cm after 90 min. However, after 120 minof annealing, the resistivity increased to 1.19 × 10⁻⁴ Ω·cm, which was attributed to the formation of large pores in the microstructure during the grain growth process [1].